Natural Molecule Wipes Out 90% of Cavity-Causing Plaque
15 December 2025 | 01:23
11:34 - August 21, 2025

Natural Molecule Wipes Out 90% of Cavity-Causing Plaque

TEHRAN (ANA)- Scientists have uncovered a natural compound that can wipe out 90% of the sticky film behind plaque and cavities, potentially transforming everyday dental care.
News ID : 9711

Found in certain vegetables, this low-toxicity molecule could one day be added to toothpaste and mouthwash to help keep teeth cleaner, stronger, and healthier. The team’s results were published in the journal Antibiotics.

A large portion of people around the globe either struggle with plaque and tooth decay on an ongoing basis or will experience them at some stage in life. While toothpaste, mouthwash, and routine dental visits help, there is still room for better solutions.

Researchers from Ben-Gurion University of the Negev, working with colleagues at Sichuan University and the National University of Singapore, have identified a naturally occurring compound called 3,3′-Diindolylmethane (DIM), also known as bisindole, that can cut down the biofilms responsible for plaque and cavities by 90%. This compound is also known to have anti-carcinogenic effects.

The human mouth provides an ideal environment for bacteria such as S. mutans, a key contributor to tooth decay. After eating, S. mutans thrives in the warm, sugary conditions inside the mouth, forming a sticky biofilm on the teeth. This biofilm leads to plaque buildup, erodes enamel, and causes cavities. In laboratory tests, bisindole (DIM) disrupted the biofilm by 90%, preventing the bacteria from multiplying.

“The molecule, which was found to have low toxicity, could be added to toothpastes and mouthwashes to greatly improve dental hygiene,” says lead author Prof. Ariel Kushmaro of the Avram and Stella Goldstein-Goren Department of Biotechnology Engineering. He is also a member of the Ilse Katz Institute for Nanoscale Science and Technology and the Goldman Sonnenfeldt School of Sustainability and Climate Change.

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